The Integration of Grounding Plane into TSV Integrated Ion Trap for Efficient Thermal Management in Large Scale Quantum Computing Device-Reference-Cited by-同舟云学术

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The Integration of Grounding Plane into TSV Integrated Ion Trap for Efficient Thermal Management in Large Scale Quantum Computing Device

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Zhao Peng¹,Li Hong Yu²,Dian Lim Yu¹,Seit Wen Wei²,Guidoni Luca³,Tan Chuan Seng¹

Affiliation:

1. Nanyang Technological University,School of Elecical and Electronic Engineering,Singapore

2. A*STAR,Institute of Microelectronics Agency for Science, Technology and Research,Singapore

3. Université de Paris,Laboratoire Matériaux et Phénomènes Quantiques,Paris,France

Funder

National Research Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816637.pdf?arnumber=9816637

Reference19 articles.

1. Surface-electrode ion trap with integrated light source

2. Integrated optical addressing of an ion qubit

3. Integrated multi-wavelength control of an ion qubit

4. State Readout of a Trapped Ion Qubit Using a Trap-Integrated Superconducting Photon Detector

5. Assembling a Ring-Shaped Crystal in a Microfabricated Surface Ion Trap

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