Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications
Author:
Affiliation:
1. Fudan University,Academy for Engineering and Technology,Shanghai,China
2. Shanghai Ltd.,Heraeus Materials Technology,Shanghai,China
3. Delft Unversity of Technology,Electronic Components, Technology, and Materials,Delft,the Netherlands
Funder
Research and Development
Fudan University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816740.pdf?arnumber=9816740
Reference9 articles.
1. Preparation of nano Cu@Ag core shell powder for electronic packaging
2. Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD
3. Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application;zhang,2012
4. Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
5. System simulation of multi-physical field coupling in electric current-assisted sintering;tan;Powder Metallurgy Technology,2020
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