3D Cryogenic Interposer for Quantum Computing Application

Author:

Li Hongyu1,Lau Aaron Chit Siong2,Jaafar Norhanani1,Lee Rainer Cheow Siong2,Wong Calvin Pei Yu2,Goh Kuan Eng Johnson2,Chui King-Jien1

Affiliation:

1. A*STAR (Agency for Science, Technology and Research),Institute of Microelectronics (IME),Singapore,138634

2. A*STAR (Agency for Science, Technology and Research),Institute of Materials Research and Engineering (IMRE),Singapore,138634

Funder

National Research Foundation

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Si Interposer With Cu TSVs on Cu Substrate Thermally and Electrically Anchoring Qubit Chips in Millikelvin Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Thermally Annealed Tantalum-filled Vertical Superconducting Interconnects for Scalable Quantum Computing Systems;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. A review on future novel interconnect and polymeric materials for cryogenic memory packaging;Journal of Materials Science: Materials in Electronics;2023-10

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