3D Cryogenic Interposer for Quantum Computing Application
Author:
Affiliation:
1. A*STAR (Agency for Science, Technology and Research),Institute of Microelectronics (IME),Singapore,138634
2. A*STAR (Agency for Science, Technology and Research),Institute of Materials Research and Engineering (IMRE),Singapore,138634
Funder
National Research Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816641.pdf?arnumber=9816641
Reference6 articles.
1. Superconducting TiN through-silicon-vias for quantum technology
2. Universal scaling of the critical temperature for thin films near the superconducting-to-insulating transition
3. Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material
4. Fabrication of Al-Based Superconducting High-Aspect Ratio TSVS for Quantum 3D Integration
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