Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation-Reference-Cited by-同舟云学术

Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Sun Zhijian¹,Yu Michael¹,Li Jiaxiong¹,Moran Macleary¹,Kathaperumal Mohanalingam²,Moon Kyoung-Sik¹,Swaminathan Madhavan²,Wong Ching-Ping¹

Affiliation:

1. Georgia Institute of Technology,School of Materials Science and Engineering,Atlanta,Georgia,United States,30332

2. Georgia Institute of Technology,School of Electrical and Computing Engineering,Atlanta,Georgia,United States,30332

Funder

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816376.pdf?arnumber=9816376

Reference17 articles.

1. Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

2. Superior Thermal Conductivity of Single-Layer Graphene

3. Thermal conductivity of isotopically modified graphene

4. Analytical study of the electronic properties of boron nitride nanosheet

5. Thermal conductivity of polycaprolactone/three-dimensional hexagonal boron nitride composites and multi-orientation model investigation

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