Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies-Reference-Cited by-同舟云学术

Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Braeuer Philipp¹,Stoll Thomas¹,Muckelbauer Martin¹,Hensel Alexander¹,Franke Joerg¹

Affiliation:

1. Institute for Factory Automation and Production Systems (FAPS),Friedrich-Alexander University Erlangen-Nuremberg,Nuremberg,Germany,90429

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816741.pdf?arnumber=9816741

Reference13 articles.

1. Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

2. Advanced Ceramics for electronic applications [online];Material properties of Rubalit® Alunit® and Zirkolit®,2022

3. Three-dimensional molded interconnect devices (3D- MID). Materials, manufacturing, assembly, and applications for injection molded circuit carriers;franke,2014

4. Test methods and influencing factors for the adhesion strength measurement of metallized structures on thermoplastic substrates;kuhn;2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),2019

5. Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes

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1. Mechanical qualification and microstructural analysis of alumina produced by material extrusion;Materials Science and Engineering: A;2023-09