Demonstration of Substrate Embedded Ni-Zn Ferrite Core Solenoid Inductors Using a Photosensitive Glass Substrate
Author:
Affiliation:
1. Korea Electronic Technology Institute, KETI,ICT Device/Packaging Research Center,Seongnam,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816550.pdf?arnumber=9816550
Reference14 articles.
1. Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications
2. Microfabrication in Foturan Photosensitive Glass Using Focused Ion Beam;anthony;World Congress on Engineering,2007
3. High performance IPDs (Integrated passive devices) and TGV (Through glass via) interposer technology using the photosensitive glass
4. Photosensitive Glass-Ceramics for Heterogeneous Integration
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