Thermal Characterization of Substrate Options for High-Power THz Multipliers Over a Broad Temperature Range-Reference-Cited by-同舟云学术

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Thermal Characterization of Substrate Options for High-Power THz Multipliers Over a Broad Temperature Range

Published:2016-03 Issue:2 Volume:6 Page:328-335
ISSN:2156-342X
Container-title:IEEE Transactions on Terahertz Science and Technology
language:
Short-container-title:IEEE Trans. THz Sci. Technol.

Author:

Kiuru Tero,Chattopadhyay Goutam,Reck Theodore J.,Minnich Austin J.,Lin Robert,Schlecht Erich,Siles Jose V.,Lee Choonsup,Mehdi Imran

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Radiation

Link

http://xplorestaging.ieee.org/ielx7/5503871/7438979/07379011.pdf?arnumber=7379011

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Analysis of THz Schottky Diode Chips with Single and Double-Row Anode Arrangement;Micromachines;2024-07-27

2. Accurate Broadband Balanced Terahertz Tripler Design with Thermal and High-Frequency Effects;2022-11-23

3. Self-Consistent Electro-Thermal Approach for Terahertz Frequency Multiplier Design;Journal of Infrared, Millimeter, and Terahertz Waves;2020-10-16

4. Development of High Power 220 GHz Frequency Triplers Based on Schottky Diodes;IEEE Access;2020

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