Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper-Reference-Cited by-同舟云学术

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Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper

Published:1999-05 Issue:2 Volume:22 Page:214-220
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Liu Y.X.,Kang E.T.,Neoh K.G.,Zhang J.F.,Cui C.Q.,Thiam Beng Lim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/16535/00763194.pdf?arnumber=763194

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Effect of Substrate Material on the Electromagnetic Properties of the Photolithography Printed Antenna;Advances in Materials Science and Engineering;2022-06-01

3. Effects of the FR 4 Substrate Realized in a Circularly Polarized UHF-RFID Reader Antenna with Fractal Geometry for Enhancing Parameters;Advances in Materials Science and Engineering;2021-07-27

4. Fabrication process for inexpensive, biocompatible and transparent PCBs. Application to a flow meter;Microelectronic Engineering;2017-04

5. Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards;Polymers for Advanced Technologies;2016-06-22

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