Processing thick multilevel polyimide films for 3-D stacked memory-Reference-Cited by-同舟云学术

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Processing thick multilevel polyimide films for 3-D stacked memory

Published:1999-05 Issue:2 Volume:22 Page:189-199
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Caterer M.D.,Daubenspeck T.H.,Ference T.G.,Holmes S.J.,Quinn R.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/16535/00763191.pdf?arnumber=763191

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex;IEEE Transactions on Advanced Packaging;2008-05

2. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications;Journal of Electronic Materials;2005-03

3. Time and temperature dependent mechanical characterization of polymer‐based materials in electronic packaging applications;Journal of the Chinese Institute of Engineers;2004-11

4. Development of polyimide flexible tactile sensor skin;Journal of Micromechanics and Microengineering;2003-02-24

5. Development of Polyimide-based Flexible Tactile Sensing Skin;MRS Proceedings;2002

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