Measurement of the Thermal Impedance Matrix of Power Modules by the Modulation Method-Reference-Cited by-同舟云学术

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Measurement of the Thermal Impedance Matrix of Power Modules by the Modulation Method

Published:2023-10 Issue:10 Volume:70 Page:5223-5227
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Smirnov Vitaliy Ivanovich¹^ORCID,Gavrikov Andrey Anatolievich¹^ORCID

Affiliation:

1. Ulyanovsk Branch, Kotelnikov Institute of Radioengineering and Electronics, Russian Academy of Sciences, Ulyanovsk, Russia

Funder

Russian Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/10261402/10231070.pdf?arnumber=10231070

Reference18 articles.

1. Thermal Impedance Meter for Power mosfet and IGBT Transistors

2. Modulation method for measuring thermal impedance components of semiconductor devices

3. Apparatus for Measurement of Thermal Impedance of High-Power Light-Emitting Diodes and LED Assemblies

4. Measuring Thermal Resistance of GaN HEMTs Using Modulation Method

5. Real-Time Prediction of Power Electronic Device Temperatures Using PRBS-Generated Frequency-Domain Thermal Cross Coupling Characteristics

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