Electrochemical Innovations for Sustainable Copper Management in Semiconductor Wastewater
Author:
Affiliation:
1. ElectraMet,Lexington,USA
2. Lewis University,Romeoville,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10545359/10545360/10545520.pdf?arnumber=10545520
Reference11 articles.
1. Effect of surfactant on package substrate in chemical mechanical planarization
2. Copper CMP Treatment Using the Copper Select™ Process;Wismer;Semi. Fab.,2005
3. An Approach for Copper and Hydrogen Peroxide Removal from Copper CMP and Solar Cell Wastewater;Wismer;Microelectronics,2016
4. Electrochemical Innovation for Sustainable Copper Management in CuCMP Wastewater;Lippert;Ultrapure Micro,2024
5. Evaluation of chelate and cation exchange resins to remove copper ions
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