Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : Advanced Equipment Processes and Materials-Reference-Cited by-同舟云学术

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Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : Advanced Equipment Processes and Materials

Published:2024-05-13 Issue: Volume: Page:01-04
ISSN:
Container-title:2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Munnangi Samuel¹,Simon Andrew¹,Van der Straten Oscar¹,Krishnan Rishi¹,Siddiqui Shahab¹,Shoudy Matthew¹

Affiliation:

1. IBM Research

Funder

IBM

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10545359/10545360/10545510.pdf?arnumber=10545510

Reference2 articles.

1. Tungsten and cobalt metallization: A material study for MOL local interconnects

2. Precleans challenges on middle-of-the-line contacts for 14nm technologies and beyond

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