Process Margin Improvement and Cost Saving from a New Plasma Oxide Etch Process with Endpoint Algorithm During Photolithography Positive- to Negative-Tone Develop Conversion-Reference-Cited by-同舟云学术

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Process Margin Improvement and Cost Saving from a New Plasma Oxide Etch Process with Endpoint Algorithm During Photolithography Positive- to Negative-Tone Develop Conversion

Published:2024-05-13 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Ye Jeff J.¹,Smith Todd²,Liew Alex²,Fritz Arika³,Sarkar Ketaki³,Fang Alan⁴

Affiliation:

1. Process Integration Engineering & Dry Etch Engineering Micron Tecchnology Viginia,Manassas,VA,USA,20110

2. Process Equipment Engineering Photolithgraphy Micron Tecchnology Viginia,Manassas,VA,USA,20110

3. Process Equipment Engineering Photolithograph Micron Technology Singapore,Singapore,Singapore,757432

4. Process Integration Engineering Micron Technology Virginia,Manassas,VA,USA,20110

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10545359/10545360/10545480.pdf?arnumber=10545480

Reference3 articles.

1. Comparison of positive tone versus negative tone resist pattern collapse behavior

2. Potential applications of negative tone development in advanced lithography

3. Optical performance comparison between negative tone development and positive tone development

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