Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling-Reference-Cited by-同舟云学术

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Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Struss Quentin,Coudrain Perceval,Colonna Jean-Philippe,Souifi Abdelkader,Gontrand Christian,Deschaseaux Edouard,Mauguen Gaelle,Mathieu Vincent,Magis Thomas,Simon Gilles,Frechette Luc G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159225.pdf?arnumber=9159225

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Design and Fabrication of a Large Area Ultrathin Vapor Chamber Based on Print-Wick-Structuring Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

5. Ultrathin flexible heat pipes with Microsorum fortunei structural-like wick for cooling flexible electronic devices;International Journal of Heat and Mass Transfer;2023-03

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