A Numerical Technique to Evaluate Warpage Behavior of Double Sided Rigid-Flex Board Assemblies during Reflow Soldering Process-Reference-Cited by-同舟云学术

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A Numerical Technique to Evaluate Warpage Behavior of Double Sided Rigid-Flex Board Assemblies during Reflow Soldering Process

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Lau Chun-Sean,Tan Yi Chun,Kuai Le Choon,Ye Ning

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159534.pdf?arnumber=9159534

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Warpage Optimization of Package Substrates Using Metamodels - A Review;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications;Energies;2023-08-08

3. A Simulation Study On SSD PCB Warpage During Reflow: From Understanding To Improvement;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

4. Numerical modelling approaches to current reflow soldering applications: a brief overview;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

5. Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process;Mathematics;2022-08-24

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