BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159194.pdf?arnumber=9159194
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Invited Paper: Ultra-Efficient Edge AI Using FeFET-based Monolithic 3D Integration;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
2. Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05
3. PIM-HLS: An Automatic Hardware Generation Tool for Heterogeneous Processing-In-Memory-based Neural Network Accelerators;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
4. 3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy;IEEE Transactions on Electron Devices;2023-02
5. From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
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