Author:
Im Yunhyeok,Cho Young-Sang,Hwang Jisoo,Lee Heeseok,Yoo Jongkyu,Jeong James,Choi Heejung,Kwon Yohan,Lee Hoi-Jin,Shin Youngmin
Cited by
3 articles.
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1. Singular Value Decomposition (SVD) based Thermal Resistance Matrix (TRM) Size Reduction for Fast Optimization of On-Die Floorplan and Temperature Sensor Placement;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Thermal Aware Floorplan Optimization of SoC in Mobile Phone;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP);2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31