Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology-Reference-Cited by-同舟云学术

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Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Ko T.,Pu H. P.,Chiang Y.,Kuo H. J.,Wang C. T.,Liu C. S.,Yu Douglas C. H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159223.pdf?arnumber=9159223

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06

2. Development of New Concept Photo Imageable Dielectric Materials for Next-Generation Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. The Enhancement in the Reliability of Nanotwinned Cu Redistribution Lines Passivated with Immersion Sn and Ag;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

4. Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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