Thermal-aware task scheduling for peak temperature minimization under periodic constraint for 3D-MPSoCs
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6963811/6966680/06966900.pdf?arnumber=6966900
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. An artificial intelligence strategy for the deployment of future microservice-based applications in 6G networks;Neural Computing and Applications;2024-03-28
2. A survey on mapping and scheduling techniques for 3D Network-on-chip;Journal of Systems Architecture;2024-02
3. Preliminaries and Related Work;Quality-of-Service Aware Design and Management of Embedded Mixed-Criticality Systems;2023-07-24
4. Thermal and Voltage-Aware Performance Management of 3-D MPSoCs With Flow Cell Arrays and Integrated SC Converters;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-01
5. NeuroMap: Efficient Task Mapping of Deep Neural Networks for Dynamic Thermal Management in High-Bandwidth Memory;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3