Editorial: Introduction to the Special Issue on Deep Learning for High-Dimensional Sensing

Author:

Yuan Xin1,Brady David J.2ORCID,Suo Jinli3ORCID,Arguello Henry4ORCID,Rodrigues Miguel5ORCID,Katsaggelos Aggelos K.6

Affiliation:

1. School of Engineering, Westlake University, Hangzhou, Zhejiang, China

2. College of Optical Sciences, University of Arizona, Tucson, AZ, USA

3. Department of Automation, Tsinghua University, Beijing, China

4. Department of System Engineering and Informatics, Universidad Industrial de Santander, Bucaramanga, Colombia

5. Department Electronic and Electrical Engineering, University College London, London, U.K.

6. Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Signal Processing

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Deep-learning enables single-pixel spectral imaging;Optoelectronic Imaging and Multimedia Technology IX;2023-01-04

2. Accelerated Unfolding Network for Medical Image Reconstruction with Efficient Information Flow;Intelligent Robotics and Applications;2023

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