Magneto-Thermal Thin Shell Approximation for 3D Finite Element Analysis of No-Insulation Coils-Reference-Cited by-同舟云学术

Magneto-Thermal Thin Shell Approximation for 3D Finite Element Analysis of No-Insulation Coils

Published:2024-05 Issue:3 Volume:34 Page:1-6
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Schnaubelt Erik¹^ORCID,Atalay Sina¹^ORCID,Wozniak Mariusz¹^ORCID,Dular Julien¹^ORCID,Geuzaine Christophe²^ORCID,Vanderheyden Benoît²^ORCID,Marsic Nicolas³^ORCID,Verweij Arjan¹^ORCID,Schöps Sebastian³^ORCID

Affiliation:

1. CERN, Meyrin, Switzerland

2. University of Liège, Liège, Belgium

3. Technical University of Darmstadt, Darmstadt, Germany

Funder

German Federal Ministry of Education and Research

Graduate School Computational Engineering

Centre for Computational Engineering

Technical University of Darmstadt

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/77/10339679/10349801.pdf?arnumber=10349801

Reference30 articles.

1. HTS Pancake Coils Without Turn-to-Turn Insulation

2. Current Status of and Challenges for No-Insulation HTS Winding Technique

3. Analyses of Transient Behaviors of No-Insulation REBCO Pancake Coils During Sudden Discharging and Overcurrent

4. Self-protection mechanisms in no-insulation (RE)Ba2Cu3Oxhigh temperature superconductor pancake coils

5. ‘Defect-irrelevant’ behavior of a no-insulation pancake coil wound with REBCO tapes containing multiple defects

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1. Fast and accurate 3D FEM model for electromagnetic simulations of no-insulation HTS coils based on polygon-anisotropic-resistivity;Superconductor Science and Technology;2024-08-21

2. Modeling of contact resistivity and simplification of 3D homogenization strategy for the H formulation;Superconductor Science and Technology;2024-06-18

3. An open-source 3D FE quench simulation tool for no-insulation HTS pancake coils;Superconductor Science and Technology;2024-05-08