Electromagnetic Simulation of No-Insulation Coils Using H – $\phi$ Thin Shell Approximation
Author:
Affiliation:
1. CERN, Meyrin, Switzerland
2. Technical University of Darmstadt, Darmstadt, Germany
Funder
German Federal Ministry of Education and Research
Graduate School Computational Engineering
Technical University of Darmstadt
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/77/10025583/10076826.pdf?arnumber=10076826
Reference38 articles.
1. Modelling Parallel-Connected, No-Insulation High-${\rm T}_c$ Superconducting Magnets
2. Finite-element modelling of no-insulation HTS coils using rotated anisotropic resistivity
3. Investigation on the Electrical Contact Resistance of Soldered Metal Insulation REBCO Coil
4. Thin-shell approach for modeling superconducting tapes in the H-φ finite-element formulation
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4. Modeling of contact resistivity and simplification of 3D homogenization strategy for the H formulation;Superconductor Science and Technology;2024-06-18
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