Scale-Up of Silver–Copper Composite Wires by Spark Plasma Sintering and Room Temperature Wire-Drawing for Use in 100 T Triple Coil at LNCMI-Reference-Cited by-同舟云学术

Scale-Up of Silver–Copper Composite Wires by Spark Plasma Sintering and Room Temperature Wire-Drawing for Use in 100 T Triple Coil at LNCMI

Published:2024-08 Issue:5 Volume:34 Page:1-4
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Tardieu S.¹^ORCID,Béard J.¹^ORCID,Mesguich D.²^ORCID,Lonjon A.²^ORCID,Ferreira N.¹^ORCID,Chevallier G.²^ORCID,Estournès C.²^ORCID,Laurent C.²^ORCID,Lecouturier-Dupouy F.¹^ORCID

Affiliation:

1. Laboratoire National des Champs Magnétiques Intenses, EMFL, CNRS-INSA-UGA-Université Toulouse 3 Paul-Sabatier, Toulouse, France

2. CIRIMAT, Université Toulouse 3 Paul-Sabatier, CNRS, Université de Toulouse, Toulouse, France

Funder

Agence Nationale de la Recherche

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/77/10496569/10444021.pdf?arnumber=10444021

Reference14 articles.

1. Design and Tests of the 100-T Triple Coil at LNCMI

2. Analytical solution for pulsed field coils placed in a magnetic field

3. Stability Aspects of the High Strength High Conductivity Microcomposite Cu-Nb Wires Properties

4. Established and Emerging Materials for use as High-Field Magnet Conductors

5. Development of high‐strength, high‐conductivity Cu–Ag alloys for high‐field pulsed magnet use

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