Analysis of a No-Insulation HTS Pancake Coil Including Multiple Resistive Joints-Reference-Cited by-同舟云学术

Analysis of a No-Insulation HTS Pancake Coil Including Multiple Resistive Joints

Published:2022-09 Issue:6 Volume:32 Page:1-5
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Musso Andrea¹^ORCID,Bang Jeseok²^ORCID,Bong Uijong²^ORCID,Breschi Marco¹^ORCID,Im Chaemin²^ORCID,Kim Geonyoung²^ORCID,Kim Jaemin²^ORCID,Park Jeong Hwan²^ORCID,Hahn Seungyong²^ORCID

Affiliation:

1. Department of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, Italy

2. Department of Electrical and Computer Engineering, Seoul National University, Seoul, Republic of Korea

Funder

Korea Medical Device Development Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/77/9712164/09769902.pdf?arnumber=9769902

Reference52 articles.

1. Quench Analysis of a Multiwidth No-Insulation 7-T 78-mm REBCO Magnet

2. Numerical analysis of thermal stability and mechanical response in a no-insulation high-temperature superconducting layer-wound coil;liu;Supercond Sci Technol,2016

3. Combined Circuit Model to Simulate Post-Quench Behaviors of No-Insulation HTS Coil

4. An equivalent circuit grid model for no-insulation HTS pancake coils

5. Basic mechanism of self-healing from thermal runaway for uninsulated REBCO pancake coils

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