Full-Field Displacement Measurement Method of Metal-As-Insulation Pancake at Liquid Nitrogen Temperature
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/77/9646455/09693123.pdf?arnumber=9693123
Reference14 articles.
1. Comparison of Local and Global Approaches to Digital Image Correlation
2. Mathematical and numerical correction of the DIC displacements for determination of stress field along crack front
3. Index of material properties, properties of solid materials from croygenic to room temperatures;nist,2021
4. Mechanics-aided digital image correlation
5. Experimental Techniques for Low-Temperature Measurements
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