Copper Encapsulated Ultra-Thin NbN Films and Damascene Structures on 300 mm Si Wafers

Author:

Kar Soumen1ORCID,Walker Harrison2ORCID,Shah Archit2ORCID,Frost Hunter3,Olson Stephen1,Mucci John1,Nalaskowski Jakub1,Martinick Brian1,Schujman Sandra1ORCID,Murray Thomas1,Johnson Corbet S.1,Wells Ilyssa1,Bourque Ronald4,Pierce Stanley4,Bhatia Ekta1ORCID,Hamilton Michael C.2ORCID,Rao Satyavolu S. Papa1ORCID

Affiliation:

1. New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY CREATES), Albany, NY, USA

2. Alabama Micro/Nano Science and Technology Center, Department of Electrical and Computer Engineering, Auburn University, Auburn, AL, USA

3. College of Nanoscale Science and Engineering, SUNY Polytechnic Institute, Albany, NY, USA

4. TEL Technology Center, America (TTCA) LLC, Albany, NY, USA

Funder

TEL Technology Center America

LLC

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Transport Properties of NbN-Cu Bilayer Superconducting Nanowires;IEEE Transactions on Applied Superconductivity;2024-05

2. High-density superconductive logic circuits utilizing 0 and π josephson junctions;Engineering Research Express;2024-02-19

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