Design of an Apparatus to Evaluate the Turn-to-Turn Thermal Conductivity of MI and NI HTS Coil-Reference-Cited by-同舟云学术

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Design of an Apparatus to Evaluate the Turn-to-Turn Thermal Conductivity of MI and NI HTS Coil

Published:2024-08 Issue:5 Volume:34 Page:1-4
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Benoist Emeric¹^ORCID,Baudouy Bertrand²^ORCID,Fazilleau Philippe¹^ORCID,Genot Clément¹^ORCID,Gouit Florian²,Lécrevisse Thibault¹^ORCID

Affiliation:

1. IRFU/DACM/LEAS, CEA, GIF-SUR-YVETTE, France

2. IRFU/DACM/LCSE, CEA, GIF-SUR-YVETTE, France

Funder

CERN-CEA HFM KE 5647

HTS MI technology for high field dipoles

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/77/10496569/10476597.pdf?arnumber=10476597

Reference10 articles.

1. Metal-as-insulation HTS coils

2. Numerical and experimental studies for the optimization and protection of NI-MI HTS coils;Genot,2022

3. Thermal Properties of ReBCO Copper Stabilized Superconducting Tapes

4. Thermal Conductivity Test of YBCO Coated Conductor Tape Stacks Interleaved With Insulated Stainless Steel Tapes

5. Database of the effect of stabilizer on the resistivity and thermal conductivity of 20 different commercial REBCO tapes

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