Development and Qualification of High Current Splices and Electrical Connections for the HL-LHC Magnets
Author:
Affiliation:
1. Magnets, Superconductors, and Cryostats Group (MSC), TE Department, CERN, Geneva, Switzerland
2. Mechanical and Materials Engineering Group (MME), EN Department, CERN, Geneva, Switzerland
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/77/10339160/10330010.pdf?arnumber=10330010
Reference11 articles.
1. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures
2. Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder
3. Consolidation of the LHC Superconducting Magnets and Circuits
4. First CERN cold masses for the HL-LHC interaction regions;prin,2023
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