Variable frequency microwave curing of photosensitive polyimides-Reference-Cited by-同舟云学术

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Variable frequency microwave curing of photosensitive polyimides

Published:2001 Issue:3 Volume:24 Page:474-481
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Famsworth K.D.,Manepalli R.N.,Bidstrup-Allen S.A.,Kohl P.A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/20488/00946496.pdf?arnumber=946496

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemistry and general applications of thermoset resins;Recent Advances and Applications of Thermoset Resins;2022

2. Polyimide in Electronics: Applications and Processability Overview;Polyimide for Electronic and Electrical Engineering Applications;2021-05-05

3. The impact of intense types of effects on poly(N‐vinyl caprolactam) and composites in the system nanoscale anatase – poly(N‐vinyl caprolactam);Journal of Applied Polymer Science;2020-09-13

4. Comparison of Conventional and Variable Frequency Microwave Curing of SU8 Photoresist: Effects on the Dielectric, Thermal, and Morphological Properties;Engineering Journal;2016-11-25

5. Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application;IEEE Transactions on Device and Materials Reliability;2015-06

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