Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Cited by
16 articles.
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1. Exploring non-destructive mechanical characterisation of hydrogels using hyperspectral imaging and machine vision;2022 28th International Conference on Mechatronics and Machine Vision in Practice (M2VIP);2022-11-16
2. The First Intelligence Layer—Environments Sensing;Five-Layer Intelligence of the Machine Brain;2022
3. Shape constraint function for artery tracking in ultrasound images;Computerized Medical Imaging and Graphics;2021-10
4. Summation;Foundations of Image Understanding;2001
5. Pattern recognition;Image Processing and Pattern Recognition;1998