1. 3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature and Power Constraints;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-08
2. High-Speed Communication in Memory Controller by Novel Pipeline Register Design;2023 Second International Conference On Smart Technologies For Smart Nation (SmartTechCon);2023-08-18
3. Empirical Evaluation of Energy Consumption for Mobile Applications;2021 12th International Conference on Information and Communication Systems (ICICS);2021-05-24
4. ScaleML: Machine Learning based Heap Memory Object Scaling Prediction;2020 9th Non-Volatile Memory Systems and Applications Symposium (NVMSA);2020-08
5. Footprint-Based DIMM Hotplug;IEEE Transactions on Computers;2020-02-01