A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving
Author:
Affiliation:
1. Columbia University,USA
2. Oregon State University,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9862947/9862948/09863112.pdf?arnumber=9863112
Reference9 articles.
1. A 27.8Gb/s 11.5pJ/b 60GHz transceiver in 28nm CMOS with polarization MIMO
2. 20.3 A 64-QAM 60GHz CMOS transceiver with 4-channel bonding
3. 13.5 A 4-antenna-path beamforming transceiver for 60GHz multi-Gb/s communication in 28nm CMOS
4. 24.9 A 128-QAM 60GHz CMOS transceiver for IEEE802.11ay with calibration of LO feedthrough and I/Q imbalance
5. Frequency-Domain-Multiplexing Single-Wire Interface and Harmonic-Rejection-Based IF Data De-Multiplexing in Millimeter-Wave MIMO Arrays
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1. A 60-GHz Phase-Invariant Variable Gain LNA With T/R Switch and Gain Interpolation Techniques in 65-nm CMOS;IEEE Microwave and Wireless Technology Letters;2024-05
2. A D-Band Transmitter Achieving 57.6-Gb/s and 30-dBm EIRP Based on Channel-Aggregation 45-Nm ICs and a Low-Profile Flat Lens Antenna;IEEE Transactions on Microwave Theory and Techniques;2024-01
3. A 57.6 Gb/s Wireless Link based on 26.4 dBm EIRP D-band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm;2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2023-06-11
4. Channel Bonding Transceivers for Efficient 100 Gb/s and Beyond Wireless and Plastic Waveguide Communications;2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS);2022-10-24
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