Nickel/palladium finish for leadframes
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx4/6144/16435/00759358.pdf?arnumber=759358
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Electrochemical polarisation behaviour of palladium electrolyte in a mixed system of Pd/Ni/Cu;AIP Conference Proceedings;2018
3. Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers;Microelectronics Reliability;2012-01
4. Accelerated Testing of Electronics to Simulate Long-Term Worldwide Environments;Uhlig's Corrosion Handbook;2011-04-19
5. Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds;Journal of Electronic Materials;2011-03-03
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