Heat Dissipation Enhancement of High-Power LEDs Through Compact Ceramic Substrate Integrated With Microchannel-Reference-Cited by-同舟云学术

Heat Dissipation Enhancement of High-Power LEDs Through Compact Ceramic Substrate Integrated With Microchannel

Author:

Tong Yao¹^ORCID,Luo Tao¹^ORCID,Wang Qing¹^ORCID,Liu Jiaxin¹,Peng Yang²^ORCID,Chen Mingxiang¹^ORCID

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

2. School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan, China

Funder

Application Innovation Program of Aerospace Science and Technology Group

National Natural Science Foundation of China

Key Research and Development Program of Hubei Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

Reference32 articles.

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