Link Layer Connectivity as a Service for Ad-Hoc Microservice Platforms-Reference-Cited by-同舟云学术

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Link Layer Connectivity as a Service for Ad-Hoc Microservice Platforms

Published:2022-01 Issue:1 Volume:36 Page:10-17
ISSN:0890-8044
Container-title:IEEE Network
language:
Short-container-title:IEEE Network

Author:

Gonzalez Luis F.¹,Vidal Ivan¹,Valera Francisco¹,Lopez Diego R.²

Affiliation:

1. Universidad Carlos III de Madrid,Spain

2. Telefónica I+D,Spain

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Computer Networks and Communications,Hardware and Architecture,Information Systems,Software

Link

http://xplorestaging.ieee.org/ielx7/65/9740617/09740640.pdf?arnumber=9740640

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