3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs-Reference-Cited by-同舟云学术

3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs

Published:2023-02 Issue:2 Volume:33 Page:157-160
ISSN:2771-9588
Container-title:IEEE Microwave and Wireless Technology Letters
language:
Short-container-title:IEEE Microw. Wireless Tech. Lett.

Author:

Zhu Liyan¹^ORCID,Shin Sang-Hee²^ORCID,Payapulli Roshan¹,Machii Taiki³,Motoyoshi Mizuki³^ORCID,Suematsu Noriharu³,Ridler Nick M.²^ORCID,Lucyszyn Stepan¹^ORCID

Affiliation:

1. Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.

2. Department of Electromagnetic and Electrochemical Technologies, National Physical Laboratory, Teddington, U.K.

3. Research Institute of Electrical Communication, Tohoku University, Sendai, Japan

Funder

U.K. Space Agency’s Centre for Earth Observation Instrumentation

Cooperative Research Project Program of the RIEC, Tohoku University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9944983/10042139/10004871.pdf?arnumber=10004871

Reference16 articles.

1. 3-D Printed Metal-Pipe Rectangular Waveguides

2. Terahertz Multi-Chip Module (T-MCM) technology for the 21st century?

3. Hybrid 3-D-Printing Technology for Tunable THz Applications

4. A Comparative Study of On-Wafer and Waveguide Module S-Parameter Measurements at D-Band Frequencies

5. 125 GHz Frequency Doubler using a Waveguide Cavity Produced by Stereolithography

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