Substrate-Integrated Waveguide Filtering Crossover Based on 3-D Assembly-Reference-Cited by-同舟云学术

Substrate-Integrated Waveguide Filtering Crossover Based on 3-D Assembly

Published:2023-05 Issue:5 Volume:33 Page:523-526
ISSN:2771-9588
Container-title:IEEE Microwave and Wireless Technology Letters
language:
Short-container-title:IEEE Microw. Wireless Tech. Lett.

Author:

Yao Beini¹,Zhang Gang¹^ORCID,Zhou Xin¹^ORCID,Li Na¹,Tang Wanchun¹^ORCID,Yang Jiquan¹^ORCID

Affiliation:

1. Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, School of Electrical and Automation Engineering, Nanjing Normal University, Nanjing, China

Funder

National Natural Science Foundation of China

Qing Lan Project of Jiangsu Province, China

Postgraduate Research and Practice Innovation Program of Jiangsu Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9944983/10122179/10017377.pdf?arnumber=10017377

Reference22 articles.

1. Miniaturized substrate integrated waveguide filtering crossover

2. Substrate integrated waveguide crossover formed by orthogonal TE102 resonators;hesari;Proc 47th Eur Microw Conf (EuMC),2017

3. Substrate Integrated Waveguide Multi-Channel Filtering Crossover With Extended Channel Number and Controllable Frequencies

4. Compact Substrate-Integrated Waveguide Filtering Crossover by Embedding CPW Quarter-Wavelength Resonators

5. Broadband ${\rm E}$-Plane Junction for Three-Dimensional Substrate Integrated Waveguide Circuits and Systems

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