Application of PCB Strain Testing in Micro-inertial Measurement Unit MEMS
Author:
Affiliation:
1. Tianjin Navigation Instruments Research Institute,Tianjin,China
2. CSSC(Tianjin) shipbuilding Co., Ltd.,Tianjin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10608459/10608497/10608549.pdf?arnumber=10608549
Reference5 articles.
1. Board-Level Solder Joint Reliability Analysis of Thermally Enhanced BGAs and LGAs
2. Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
3. Effects of PCB design variations on bend and ATC performance of lead-free solder joints
4. Computational Parameteric Study on the Strain Hardening Effect of Lead-free Solder Joint in Board Level Mechanical Drop Test[A];TONG
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