A Feature Engineering-based Method for PCB Solder Paste Position Offset Prediction-Reference-Cited by-同舟云学术

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A Feature Engineering-based Method for PCB Solder Paste Position Offset Prediction

Published:2023-06-23 Issue: Volume: Page:
ISSN:
Container-title:2023 6th International Symposium on Autonomous Systems (ISAS)
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Author:

Liu Binkun¹,Zhao Yunbo²,Kang Yu²,Cao Yang³,Bai Peng¹,Xu Zhenyi⁴

Affiliation:

1. University of Science and Technology of China,Department of Automation,Hefei,China

2. University of Science and Technology of China Institute of Artificial Intelligence, Hefei Comprehensive National Science Center Institute of Advanced Technology, University of Science and Technology of China,Department of Automation,Hefei,China

3. University of Science and Technology of China Institute of Artificial Intelligence, Hefei Comprehensive National Science Center,Department of Automation,Hefei,China

4. Institute of Artificial Intelligence,Hefei Comprehensive National Science Center,Hefei,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10164121/10164123/10164303.pdf?arnumber=10164303

Reference21 articles.

1. Adaptive optimal control of stencil printing process using reinforcement learning

2. An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology

3. Residue buildup predictive modeling for stencil cleaning profile decision-making using recurrent neural network

4. Support-vector networks

5. The origins of logistic regression;cramer;Econometrics eJournal,2002

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