Author:
Wen-Chau Liu ,Kong-Beng Thei ,Hung-Ming Chuang ,Kun-Wei Lin ,Chin-Chuan Cheng ,Yen-Shih Ho ,Chi-Wen Su ,Shyh-Chyi Wong ,Chih-Hsien Lin ,Diaz C.H.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
16 articles.
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1. Simulation of Electrical Conductivity in poly-Si Films under Joule Heating Using TCAD Sentaurus;2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM);2022-06-30
2. Towards the Development of Cryogenic Integrated Power Management Units;2022 IEEE 15th Workshop on Low Temperature Electronics (WOLTE);2022-06-06
3. Evaluation of stability and robustness of poly-Si resistors with different dopant concentrations;Japanese Journal of Applied Physics;2021-12-24
4. Passive Components;Silicon Analog Components;2019-08-08
5. Passive Components;Silicon Analog Components;2015