Backside Wafer Damage Induced Wafer Front Side Defect and Yield Impact-Reference-Cited by-同舟云学术

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Backside Wafer Damage Induced Wafer Front Side Defect and Yield Impact

Published:2007-06 Issue: Volume: Page:
ISSN:
Container-title:2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Wang Neng-Cheng,Chang Hui-An,Chang Chung-I,Wang Tings

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4259214/4259215/04259247.pdf?arnumber=4259247

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pre-Litho Back-Side Etch for Improved Flatness and Yield;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

2. Removal of Macro Aluminum Defects on Wafer Backside;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

3. 40nm Backside Optimization and Improvement;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20

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