Influence of parameters of bidirectional pulse power supply on copper plating on printed circuit board-Reference-Cited by-同舟云学术

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Influence of parameters of bidirectional pulse power supply on copper plating on printed circuit board

Published:2022-11-04 Issue: Volume: Page:
ISSN:
Container-title:2022 9th International Forum on Electrical Engineering and Automation (IFEEA)
language:
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Author:

Wang Shoutao¹,Chen Wenguang¹,Liu Zhijian¹,Wei Caiyi¹,Peng Yuanyuan¹

Affiliation:

1. University of South China,School of Electrical Engineering,Hengyang,China

Funder

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10037755/10037579/10038184.pdf?arnumber=10038184

Reference10 articles.

1. Making sense of plating chemistries;bowerman;J PCB007 Mag,2020

2. Research and application of copper plating technology in printed circuits;wang;J Electrochem,2021

3. Multi-physics coupling aid uniformity improvement in pattern plating

4. Application of copper plating technology in electronic materials;yu;Electroplating & Finishing,2007

5. PCB copper plating process and handling of common problems J;lin;Printed Circuit Information,2009

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