Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects
Author:
Affiliation:
1. School of Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR, USA
Funder
Center for Design of Analog-Digital Integrated Circuits
Hewlett-Packard Development Company
Tower Semiconductor
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx8/4156126/10643416/10574864.pdf?arnumber=10574864
Reference35 articles.
1. Lab-on-CMOS: Integrating microfluidics and electrochemical sensor on CMOS
2. System-on-Chip Considerations for Heterogeneous Integration of CMOS and Fluidic Bio-Interfaces
3. Super-Resolution Electrochemical Impedance Imaging With a 512 × 256 CMOS Sensor Array
4. Real-Time Measurements of Cell Proliferation Using a Lab-on-CMOS Capacitance Sensor Array
5. Integrated circuit-based electrochemical sensor for spatially resolved detection of redox-active metabolites in biofilms
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