High-frequency vibration tests of Sn-Pb and lead-free solder joints-Reference-Cited by-同舟云学术

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High-frequency vibration tests of Sn-Pb and lead-free solder joints

Published:2008-09 Issue: Volume: Page:
ISSN:
Container-title:2008 2nd Electronics Systemintegration Technology Conference
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Author:

Di Maio D.,Hunt C.P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4658784/4684310/04684457.pdf?arnumber=4684457

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation Into How the Floor Plan Layout of a Manufactured PCB Influences Flip-Chip Susceptibility to Vibration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05

2. Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder;Circuit World;2013-02

3. Putting 3D interconnection technologies into perspective from chip to system;Circuit World;2012-02-03

4. Lead-Free Reliability in Aerospace/Military Environments;Lead-Free Solder Process Development;2011-02-25

5. A solder joint fatigue life model for combined vibration and temperature environments;2009 59th Electronic Components and Technology Conference;2009-05

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