Author:
Barnhart C.,Brunkhorst V.,Distler F.,Farnsworth O.,Ferko A.,Keller B.,Scott D.,Koenemann B.,Onodera T.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software,Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
52 articles.
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2. A Novel Test Data Compaction Method with Improved Debug Capabilities of the Signatures;2023 IEEE International Test Conference India (ITC India);2023-07-23
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