Thermal Characteristics of Mirror-Based Optical Redistribution for Co-Packaged Optics
Author:
Affiliation:
1. National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki, Japan
2. Photonics Electronics Technology Research Association (PETRA), Tsukuba, Japan
Funder
New Energy and Industrial Technology Development Organization
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/50/10251069/10144483.pdf?arnumber=10144483
Reference27 articles.
1. Simultaneous error-free data modulation with silicon microdisks in the multi-FSR regime for scalable DWDM links;gopal;Proc Opt Fiber Commun Conf,2023
2. PINE: Photonic Integrated Networked Energy efficient datacenters (ENLITENED Program) [Invited]
3. Demonstration of silicon-photonics hybrid glass-epoxy substrate for co-packaged optics;noriki;Proc Eur Conf Opt Commun,2022
4. Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics
5. Ranovus demonstrates industry's first adaptive compute acceleration co-packaged optics platform with Xilinx Versal and Ranovus Odin™ 800Gbps CPO 2.0,2022
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