Multi-Axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components
Author:
Affiliation:
1. POET Technologies, Singapore
2. National University of Singapore, Singapore
Funder
National Research Foundation Singapore
NRF's Medium Sized Centre: Singapore Hybrid-Integrated Next-Generation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/50/10164793/10141616.pdf?arnumber=10141616
Reference20 articles.
1. Flip-chip bonding: How to meet high accuracy requirements?
2. 3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
3. A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM
4. Single-chip hybrid integrated silicon photonics transmitter based on passive alignment
5. Design of quasi-kinematic couplings
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