4×100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset With Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators-Reference-Cited by-同舟云学术

4×100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset With Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators

Published:2023-08-15 Issue:16 Volume:41 Page:5350-5358
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Levy Jacob S.¹,Timurdogan Erman¹,Kuo Yu-Sheng¹,Lyu Gap Youl¹,Tsai Charles¹,Yan Xuejin¹,Kim Harqkyun¹,Stagarescu Cristian¹,Meneou Kevin¹,Thomas Abu¹,Fragkos Ioannis¹,Sitwell Geoffrey¹,Trita Andrea¹^ORCID,Liu Yangyang¹,Ziebel Melissa¹,Byrd Jerry¹,Steinbach Sven²,Chou Bruce¹,Vis William¹,Abed Arin¹,Kwon Young¹,Nykänen Henri³,Lo Shih-Han²,Ikonen Janne²,Larismaa Juha³,Drake John²,Benzoni Albert¹,Minkenberg Cyriel²,Schrans Thomas¹^ORCID,Rickman Andrew²

Affiliation:

1. Rockley Photonics Inc., Pasadena, CA, USA

2. Rockley Photonics Ltd., Newport, U.K.

3. Rockley Photonics Oy, Espoo, Finland

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/50/10196303/10086955.pdf?arnumber=10086955

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5. 4 × 56 Gb/s High Output Power Electroabsorption Modulated Laser Array With up to 7 km Fiber Transmission in L-Band