Electrical and thermal investigations on printed conductive paste used in solderless assembly for electronics technology-Reference-Cited by-同舟云学术

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Electrical and thermal investigations on printed conductive paste used in solderless assembly for electronics technology

Published:2017-10 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Author:

Ionescu Ciprian,Codreanu Norocel-Dragos,Varzaru Gaudentiu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8245948/8259843/08259855.pdf?arnumber=8259855

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monitoring the homogeneity of temperature fields in thermal chambers;2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE);2024-06-27

2. Thermal investigations on LED modules realized using solderless assembly for electronics technology;Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies XI;2023-03-02

3. Examination of Wet Assembling Methods in Printed Flexible Electronics;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11

4. Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging;The Journal of Adhesion;2020-12-22

5. Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications;Journal of Materials Science: Materials in Electronics;2020-11-25

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