Using SPICE for reliability based design of capacitor bank for telecom power supplies-Reference-Cited by-同舟云学术

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Using SPICE for reliability based design of capacitor bank for telecom power supplies

Published:2017-10 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Author:

Butnicu Dan,Neacsu Dorin O.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8245948/8259843/08259939.pdf?arnumber=8259939

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Study for DC-DC Converter Output Bank’s Reliability Evaluation Using Prediction Standards MIL-HDBK-217F vs. Telcordia SR-332;Energies;2024-08-09

2. A Study of Switching Frequency Impact on Reliability of DC-DC PoL Converters With Discrete Transistors;IEEE Transactions on Industry Applications;2023-09

3. Practical Considerations for Using Telcordia SR-332 Reliability Standard Prediction Applied to a DC-DC PoL Converter Case;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. POL DC-DC Converter Output Capacitor Bank’s Reliability Comparison using Prediction Standard MIL-HDBK-217F and SN 29500;2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME);2021-10-27

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